An equipment used to reflow solder surface mount electronic components to printed circuit boards is the LINK-LF635 6 ZONE SMT REFLOW OVEN.
the LINK-LF635 6 ZONE SMT REFLOW OVEN has characteristics and capabilities that are astounding. It is appropriate for lead-free welding and the welding area has a rosin flux recovery system to safeguard the environment. It is a unique and high-temperature resistant protection system heating preservation system and special furnace iron.
What makes reflow soldering essential? Well, Reflow soldering creates solid, long-lasting junctions. The joints are stable since there is no heat stress to them. Additionally, they need less monitoring and the process is run under strict controls. Surface mount component soldering is best done using the reflow soldering technique.
The heating preservation system’s extraordinary high-temperature resistant protection system and the furnace’s specific iron. Utilizing an imported Taiwan SanYue long axis high-temperature fan motor and a W-shaped heat pipe, this system is noiseless, shockproof, and simple to maintain. It utilizes an imported PID intelligent precision control system and fuzzy control technology for the thermostat. By using PID intelligent operation and automated control heating, it can quickly respond to changes in external heat and ensure greater temperature balance.